Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
- Ram Krishna
- Atom O. Watanabe
- et al.
- 2023
- ECTC 2023
Publications
Date
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21 results for Ravi Bonam
Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- Mukta Farooq
- Arvind Kumar
- et al.
- 2022
- ECTC 2022
Stacked Silicon Microcoolers
- M. Bergendahl
- Dario Goldfarb
- et al.
- 2020
- ITherm 2020
Fundamental characterization of stochastic variation for improved single-expose EUV patterning at aggressive pitch
- Jennifer Church
- Luciana Meli
- et al.
- 2020
- SPIE Advanced Lithography 2020
Inspection / metrology evaluation of fine pitch test vehicles for advanced packages
- Feng Xue
- Joe Zou
- et al.
- 2019
- ICEP 2019
Engineering neural networks for improved defect detection and classification
- Dhruv V. Patel
- Ravi Bonam
- et al.
- 2019
- SPIE Advanced Lithography 2019
EUV mask challenges and requirements for ultimate single exposure interconnects
- Chris Progler
- Michael Green
- et al.
- 2019
- SPIE Advanced Lithography 2019
An OCD perspective of line edge and line width roughness metrology
- Ravi Bonam
- R. Muthinti
- et al.
- 2017
- SPIE Advanced Lithography 2017
Printability and actinic AIMS review of programmed mask blank defects
- Erik Verduijn
- Pawitter Mangat
- et al.
- 2017
- SPIE Advanced Lithography 2017
Comprehensive analysis of line-edge and line-width roughness for EUV lithography
- Ravi Bonam
- Chi Chun Liu
- et al.
- 2017
- SPIE Advanced Lithography 2017