Peter Madakson, John Bruley
Applied Physics Letters
Thin carbon films were deposited by ion beam sputtering at temperatures of 77-1073 K. Using Rutherford backscattering spectrometry and electron energy loss spectroscopy, the trends in film density and bonding were examined as a function of deposition conditions. It has been found that film density and sp3 bonding character unexpectedly increased with increased substrate thermal conductivity and decreasing substrate temperature, reaching values of 2.9 g/cc and 50%, respectively.
Peter Madakson, John Bruley
Applied Physics Letters
Yun-Yu Wang, J. Nxumalo, et al.
Applied Physics Letters
Pouya Hashemi, Takashi Ando, et al.
IEDM 2017
Sangbum Kim, Stephen L. Brown, et al.
Journal of Applied Physics