N.J. Chou, T.H. Zabel, et al.
Nuclear Inst. and Methods in Physics Research, B
The thermal stability of polycrystalline silicon/metal oxide interfaces was investigated by using transmission electron microscopy (TEM). TEM showed strong reactions at the poly-Si/metal oxide interface when annealed at 1000°C. It was found that the thermal stability of polycrystalline silicon/metal oxide interface was significantly enhanced when the poly-Si was plasma deposited using silane diluted in He.
N.J. Chou, T.H. Zabel, et al.
Nuclear Inst. and Methods in Physics Research, B
A.C. Callegari, D. Lacey, et al.
Solid-State Electronics
A.C. Callegari, E. Cartier, et al.
Journal of Applied Physics
E. Gusev, D.A. Buchanan, et al.
Microelectronic Engineering