Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
The crystallization temperature of GeSbTe thin films with thicknesses between 11 and 87 nm on silicon nitride was studied through resistance versus temperature measurements. The amorphous-cubic phase transition occurs at ∼ 150 °C for all films thicknesses, whereas the cubic-hexagonal phase transition temperature increases with film thickness, from ∼ 200 °C for the 20 nm film to ∼ 250 °C for the 87 nm film. The cubic-hexagonal transition occurs gradually for the 11 nm film. Implications for phase-change memory devices are discussed. © 2011 Elsevier B.V. All rights reserved.
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
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SPIE AeroSense 1997
S.F. Fan, W.B. Yun, et al.
Proceedings of SPIE 1989
Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting