High-speed precision handling technology of micro-chip for fan-out wafer level packaging (FOWLP) application
- Qianwen Chen
- Li-Wen Hung
- et al.
- 2018
- ECTC 2018
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39 results for Russell A. Budd
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
- John Knickerbocker
- Russell A. Budd
- et al.
- 2018
- ECTC 2018
A Four-Channel Silicon Photonic Carrier with Flip-Chip Integrated Semiconductor Optical Amplifier (SOA) Array Providing >10-dB Gain
- Fuad Doany
- Russell A. Budd
- et al.
- 2016
- ECTC 2016
Semiconductor optical amplifier (SOA) packaging for scalable and gain-integrated silicon photonic switching platforms
- Russell A. Budd
- Laurent Schares
- et al.
- 2015
- ECTC 2015
Advanced wafer bonding and laser debonding
- Paul Andry
- Russell A. Budd
- et al.
- 2014
- ECTC 2014
High-speed signaling performance of multilevel wiring on glass substrates for 2.5-D integrated circuit and optoelectronic integration
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2013
- ECTC 2013
Terabit/sec-class board-level optical interconnects through polymer waveguides using 24-channel bidirectional transceiver modules
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2011
- ECTC 2011
160-Gb/s bidirectional parallel optical transceiver module for board-level interconnects using a single-chip CMOS IC
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2007
- ECTC 2007
MCM LGA package with optical I/O passively aligned to dual layer polymer waveguides in PCB
- Frank R. Libsch
- R. Budd
- et al.
- 2006
- ECTC 2006
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ECTC 2005