Electrical characteristics of lossy interconnections for high-performance computer applications
- A. Deutsch
- G.V. Kopcsay
- et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
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36 results for Jurij Paraszczak
Oxygen induced adhesion degradation at metai/polyimide interface
- Da-Yuan Shih
- Nancy Klymko
- et al.
- 1991
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Comparison of vapor and liquid phase silylation processes of photoresists
- E. Babich
- J. Paraszczak
- et al.
- 1991
- Microelectronic Engineering
Silylation of (photo)resist materials using polyfunctional organosilicon compounds
- E. Babich
- J. Paraszczak
- et al.
- 1989
- ACS National Meeting 1989
A simple bilayer lift-off process
- David F. Witman
- Jane M. Shaw
- et al.
- 1990
- Microelectronic Engineering
Silylation of resist materials using di- and polyfunctional organosilicon compounds
- E. Babich
- J. Paraszczak
- et al.
- 1990
- Microelectronic Engineering
The effect of solvent absorption on the electrical and dielectric properties of polyimide films
- D.Y. Shih
- J. Cataldo
- et al.
- 1990
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Chemistry of hexamethylcyclotrisilazane (HMCTS) silylation
- K.J. Stewart
- J.M. Shaw
- et al.
- 1989
- Symposium on Patterning Science and Technology 1989
Chemical and physical aspects of multilayer resist processing
- J. Paraszczak
- E. Babich
- et al.
- 1989
- Proceedings of SPIE 1989
A comparison of the E-beam sensitivities and relative O2-plasma stabilities of organosilicon polymers.Part III. Lithographic characteristics of poly-1,1,3-trimethyl-1-sila - and poly-1,1,3,3-tetramethyl-1,3- disilacyclobutenes and related silmethylene polymers
- E. Babich
- J. Paraszczak
- et al.
- 1989
- Microelectronic Engineering