Organosilicon polymers for lithographic applications
- J.M. Shaw
- M. Hatzakis
- et al.
- 2004
- Polymer Engineering & Science
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36 results for Jurij Paraszczak
In‐plane solvent diffusion in a photosensitive polyimide
- Da‐Yuan Shih
- Sharon Nunes
- et al.
- 2003
- Journal of Applied Polymer Science
Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
- Da-Yuan Shih
- Helen L. Yeh
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
An isotope approach to characterization of microwave water plasma modified polyimide surfaces
- N.J. Chou
- A.D. Marwick
- et al.
- 1992
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Cu passivation: A method of inhibiting copper-polyamic acid interactions
- D.Y. Shih
- J. Kim
- et al.
- 1991
- Applied Physics Letters
Thin-film interdiffusions in Cu/Pd, Cu/Pt, Cu/Ni, Cu/NiB, Cu/Co, Cu/Cr, Cu/Ti, and Cu/TiN bilayer films: Correlations of sheet resistance with Rutherford backscattering spectrometries
- D.Y. Shih
- C.A. Chang
- et al.
- 1991
- Journal of Applied Physics
Comparison of vapor and liquid phase silylation processes of photoresists
- E. Babich
- J. Paraszczak
- et al.
- 1991
- Microelectronic Engineering
Oxygen induced adhesion degradation at metai/polyimide interface
- Da-Yuan Shih
- Nancy Klymko
- et al.
- 1991
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
A simple bilayer lift-off process
- David F. Witman
- Jane M. Shaw
- et al.
- 1990
- Microelectronic Engineering
The effect of solvent absorption on the electrical and dielectric properties of polyimide films
- D.Y. Shih
- J. Cataldo
- et al.
- 1990
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films