Hiroshi Ito, Reinhold Schwalm
JES
This paper discusses a simplified "lift-off" process, which consists of two layers. This consists of an underlayer of soluble, thermally stable polyimide, and a new process, "silylation", which converts typical positive photoresists into oxygen RIE barriers. The uses of this new material and process for chip and packaging applications are described in this paper. © 1990.
Hiroshi Ito, Reinhold Schwalm
JES
Surendra B. Anantharaman, Joachim Kohlbrecher, et al.
MRS Fall Meeting 2020
S.F. Fan, W.B. Yun, et al.
Proceedings of SPIE 1989
T.N. Morgan
Semiconductor Science and Technology