Dipanjan Gope, Albert E. Ruehli, et al.
IEEE T-MTT
This paper discusses a simplified "lift-off" process, which consists of two layers. This consists of an underlayer of soluble, thermally stable polyimide, and a new process, "silylation", which converts typical positive photoresists into oxygen RIE barriers. The uses of this new material and process for chip and packaging applications are described in this paper. © 1990.
Dipanjan Gope, Albert E. Ruehli, et al.
IEEE T-MTT
S.F. Fan, W.B. Yun, et al.
Proceedings of SPIE 1989
A. Krol, C.J. Sher, et al.
Surface Science
David B. Mitzi
Journal of Materials Chemistry