Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- Qianwen Chen
- Michael Belyansky
- et al.
- 2023
- ECTC 2023
Publications
17 results for Fee Li Lie
HERMES-Core-A 1.59-TOPS/mm2PCM on 14-nm CMOS In-Memory Compute Core Using 300-ps/LSB Linearized CCO-Based ADCs
- Riduan Khaddam-Aljameh
- Milos Stanisavljevic
- et al.
- 2022
- IEEE JSSC
Fully On-Chip MAC at 14 nm Enabled by Accurate Row-Wise Programming of PCM-Based Weights and Parallel Vector-Transport in Duration-Format
- Pritish Narayanan
- Stefano Ambrogio
- et al.
- 2021
- IEEE T-ED
Fully on-chip MAC at 14nm enabled by accurate row-wise programming of PCM-based weights and parallel vector-transport in duration-format
- P. Narayanan
- S. Ambrogio
- et al.
- 2021
- VLSI 2021
HERMES Core - A 14nm CMOS and PCM-based In-Memory Compute Core using an array of 300ps/LSB Linearized CCO-based ADCs and local digital processing
- R. Khaddam-Aljameh
- M. Stanisavljevic
- et al.
- 2021
- VLSI Technology 2021
HERMES Core - A 14nm CMOS and PCM-based In-Memory Compute Core using an array of 300ps/LSB Linearized CCO-based ADCs and local digital processing
- Riduan Khaddam-Aljameh
- Milos Stanisavljevic
- et al.
- 2021
- VLSI Circuits 2021
CMP Defect Reduction and Mitigation: Practices and Future Trends
- Wei-Tsu Tseng
- Carol Boye
- et al.
- 2021
- ASMC 2021
A Systematic Study on BEOL Defectivity Control for Future AI Application
- James H.-C. Chen
- Fee Li Lie
- et al.
- 2020
- ASMC 2020
Parasitic Resistance Reduction Strategies for Advanced CMOS FinFETs beyond 7nm
- Heng Wu
- Oleg Gluschenkov
- et al.
- 2018
- IEDM 2018
External Resistance Reduction by Nanosecond Laser Anneal in Si/SiGe CMOS Technology
- Oleg Gluschenkov
- Heng Wu
- et al.
- 2018
- IEDM 2018