Fabrication challenges for next generation devices: MEMS for RF wireless communications
- David Seeger
- Jennifer Lund
- et al.
- 2002
- Proceedings of SPIE - The International Society for Optical Engineering
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38 results for P.C. Andricacos
Sub-micron platinum electrodes by through-mask plating
- K.L. Saenger
- G. Costrini
- et al.
- 2000
- ECS Meeting 2000
Electrodes and barriers for dram and feram: Processing, integration, and fundamentals
- K.L. Saenger
- P.C. Andricacos
- et al.
- 2001
- MRS Online Proceedings Library
Submicrometer Platinum Electrodes by Through-Mask Plating
- K.L. Saenger
- G. Costrini
- et al.
- 2001
- JES
Copper on-chip interconnections: A breakthrough in electrodeposition to make better chips
- Panos C. Andricacos
- 1999
- Electrochemical Society Interface
Pb-free solder alloys for flip chip applications
- S.K. Kang
- J. Horkans
- et al.
- 1999
- ECTC 1999
Characterization of plated Cu thin film microstructures
- L. Gignac
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
Mechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- Journal of Applied Physics
Copper dual damascene wiring for sub-0.25 μm CMOS technology
- J. Heidenreich
- D. Edelstein
- et al.
- 1998
- IITC 1998