Upside-down FETS
- D.C. La Tulipe Jr.
- D.J. Frank
- et al.
- 2008
- IEEE International SOI Conference 2008
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20 results for D.C. La Tulipe
Wafer-level 3D integration technology
- Steven J. Koester
- Albert M. Young
- et al.
- 2008
- IBM J. Res. Dev
Critical aspects of layer transfer and alignment tolerances for 3D integration processes
- D.C. La Tulipe
- L.T. Shi
- et al.
- 2006
- GBC 2006
Three-dimensional integrated circuits
- Anna W. Topol
- Douglas C. La Tulipe Jr.
- et al.
- 2006
- IBM J. Res. Dev
Process optimization for high electron mobility in nMOSFETs with aggressively scaled HfO2/metal stacks
- V. Narayanan
- K. Maitra
- et al.
- 2006
- IEEE Electron Device Letters
Assembly technology for three dimensional integrated circuits
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- VMIC 2005
Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- IEDM 2005
High resolution 248 nm bilayer resist
- Q. Lin
- K.E. Petrillo
- et al.
- 1999
- SPIE Advances in Resist Technology and Processing 1999
Extension of 248 nm optical lithography: A thin film imaging approach
- Qinghuang Lin
- Ahmad D. Katnani
- et al.
- 1998
- Microlithography 1998
Low energy electron beam top surface image processing using chemically amplified AXT resist
- C.S. Whelan
- D.M. Tanenbaum
- et al.
- 1997
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures