Study of spalling behavior of Intel-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders
- Yoon-Chul Sohn
- Jin Yu
- et al.
- 2004
- ECTC 2004
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67 results for D.Y. Shih
Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- ECTC 2004
Study of IMC morphologies and phase characteristics affected by the reactions of Ni and Cu metallurgies with Pb-free solder joints
- Won Kyoung Choi
- Sung K. Kang
- et al.
- 2003
- ECTC 2003
Formation of Ag3Sn plates in Sn-Ag-Cu alloys and optimization of their alloy composition
- Sung K. Kang
- Won Kyoung Choi
- et al.
- 2003
- ECTC 2003
Interfacial reaction studies on lead (Pb)-free solder alloys
- S.K. Kang
- D.Y. Shih
- et al.
- 2001
- ECTC 2001
Foamed elastomers for packaging interconnections, testing and burn-in applications
- Yun-Hsin Liao
- D.Y. Shih
- et al.
- 1996
- MRS Fall Meeting 1996
Effect of polyimide processing on multichip glass ceramic module fabrications
- D.Y. Shih
- 1996
- ECTC 1996
New ball grid array module test sockets
- D.Y. Shih
- Paul Lauro
- et al.
- 1996
- ECTC 1996
Novel elastomeric connector for packaging interconnections, testing and burn-in applications
- D.Y. Shih
- Brian Beaman
- et al.
- 1995
- ECTC 1995
Adhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995