An overview of Pb-free, flip-chip wafer-bumping technologies
- Sung K. Kang
- Peter Gruber
- et al.
- 2008
- JOM
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67 results for D.Y. Shih
Electromigration in Pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2008
- ICEPT-HDP 2008
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- D.Y. Shih
- B. Dang
- et al.
- 2008
- ICEPT-HDP 2008
Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders
- Sung K. Kang
- Moon Gi Cho
- et al.
- 2008
- ECTC 2008
Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
- Minhua Lu
- Paul Lauro
- et al.
- 2008
- ECTC 2008
C4NP Cu-cored Pb-free flip chip interconnections
- Jae-Woong Nah
- Stephen L. Buchwalter
- et al.
- 2008
- ECTC 2008
50μm pitch Pb-free micro-bumps by C4NP technology
- Bing Dang
- Da-Yuan Shih
- et al.
- 2008
- ECTC 2008
An investigation of microstructure and microhardness of Sn-Cu and Sn-Ag solders as functions of alloy composition and cooling rate
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2008
- Journal of Electronic Materials
Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2008
- Applied Physics Letters
Lead free micro bumping - Cost & yield challenges
- Klaus Ruhmer
- Emmett Hughlett
- et al.
- 2007
- EPTC 2007