Polyimide stress cushion for multichip glass-ceramic module packaging
- D.Y. Shih
- P. Palmateer
- et al.
- 1995
- ECTC 1995
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67 results for D.Y. Shih
Comparison of electromigration behaviors of SnAg and SnCu solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- IRPS 2009
C4NP technology: Present and future
- Eric Perfecto
- Da-Yuan Shih
- et al.
- 2008
- GBC 2008
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- D.Y. Shih
- B. Dang
- et al.
- 2008
- ICEPT-HDP 2008
Electromigration in Pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2008
- ICEPT-HDP 2008
Lead free micro bumping - Cost & yield challenges
- Klaus Ruhmer
- Emmett Hughlett
- et al.
- 2007
- EPTC 2007
Spalling behaviors of intel-metallic compounds during the etting reaction of Sn(3.5Ag) on electroless Ni-P metallization
- Yoon-Chul Sohn
- Jin Yu
- et al.
- 2004
- AGEC 2004
Oxidation study of pure tin and its alloys via electrochemical reduction analysis
- Sungil Cho
- Jin Yu
- et al.
- 2004
- Symposium on “Challenges in Advanced Thin Films: Microstructures, Interfaces, and Reactions" 2004
Effects of Mechanical Deformation and Annealing on the Microstructure and Hardness of Pb-Free Solders
- Paul Lauro
- Sung K. Kang
- et al.
- 2003
- Journal of Electronic Materials
Electrical characteristics of lossy interconnections for high-performance computer applications
- A. Deutsch
- G.V. Kopcsay
- et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990