Foamed elastomers for packaging interconnections, testing and burn-in applications
- Yun-Hsin Liao
- D.Y. Shih
- et al.
- 1996
- MRS Fall Meeting 1996
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67 results for D.Y. Shih
New ball grid array module test sockets
- D.Y. Shih
- Paul Lauro
- et al.
- 1996
- ECTC 1996
Effect of polyimide processing on multichip glass ceramic module fabrications
- D.Y. Shih
- 1996
- ECTC 1996
An xps study of argon ion beam and oxygen rie modified bpda-pda polyimide as related to adhesion
- Richard Flitsch
- Da-Yuan Shih
- 1996
- Journal of Adhesion Science and Technology
Effect of polyimide processing on multichip glass ceramic module fabrications
- D.Y. Shih
- 1996
- IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing
Polyimide stress cushion for multichip glass-ceramic module packaging
- D.Y. Shih
- P. Palmateer
- et al.
- 1995
- ECTC 1995
Adhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995
Novel elastomeric connector for packaging interconnections, testing and burn-in applications
- D.Y. Shih
- Brian Beaman
- et al.
- 1995
- ECTC 1995
Use of high temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface modified by an ac nitrogen glow discharge
- J.B. Ma
- J. Dragon
- et al.
- 1995
- Journal of Adhesion Science and Technology
Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
- Da-Yuan Shih
- Helen L. Yeh
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology