Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
- Sung K. Kang
- Won Kyoung Choi
- et al.
- 2003
- JOM
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67 results for D.Y. Shih
Study of the reaction mechanism between electroless Ni-P and Sn and its effect on the crystallization of Ni-P
- Y.C. Sohn
- Jin Yu
- et al.
- 2003
- Journal of Materials Research
Interfacial reaction studies on lead (Pb)-free solder alloys
- Sung K. Kang
- D.Y. Shih
- et al.
- 2002
- IEEE Transactions on Electronics Packaging Manufacturing
Studies of the mechanical and electrical properties of lead-free solder joints
- S.K. Kang
- W.K. Choi
- et al.
- 2002
- Journal of Electronic Materials
A study of the effects of solder volume on the interfacial reactions in solder joints using the differential scanning calorimetry technique
- W.K. Choi
- S.K. Kang
- et al.
- 2002
- Journal of Electronic Materials
Ag3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys
- Donald W. Henderson
- Timothy Gosselin
- et al.
- 2002
- Journal of Materials Research
Interfacial reactions, microstructure and mechanical properties of Pb-free solder joints in PBGA laminates
- S.K. Kang
- W.K. Choi
- et al.
- 2002
- Proceedings - Electronic Components and Technology Conference
An xps study of argon ion beam and oxygen rie modified bpda-pda polyimide as related to adhesion
- Richard Flitsch
- Da-Yuan Shih
- 1996
- Journal of Adhesion Science and Technology
Effect of polyimide processing on multichip glass ceramic module fabrications
- D.Y. Shih
- 1996
- IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing
Use of high temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface modified by an ac nitrogen glow discharge
- J.B. Ma
- J. Dragon
- et al.
- 1995
- Journal of Adhesion Science and Technology