Warpage analysis of organic substrates for 2.1D packaging
- Sayuri Kohara
- Keishi Okamoto
- et al.
- 2015
- 3DIC 2015
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21 results for Keishi Okamoto
Effects of low CTE materials on thermal deformation of organic substrates in flip chip package application
- Hiroyuki Mori
- Sayuri Kohara
- et al.
- 2015
- InterPACK 2015
Warpage modeling technique of organic interposer considering deformation by insulator material shrinkage
- Keishi Okamoto
- Sayuri Kohara
- et al.
- 2015
- ICEP-IAAC 2015
Electrical assessment of chip to chip connection for ultra high density organic interposer
- Keishi Okamoto
- Hiroyuki Mori
- et al.
- 2014
- ICEP 2014
Electrical capability assessment for high wiring density organic interposer
- Keishi Okamoto
- Hiroyuki Mori
- et al.
- 2013
- EDAPS 2013
Electrical characterization of low-cost glass/epoxy laminates at millimeter wave frequencies
- Noam Kaminski
- Evgeny Shumakher
- et al.
- 2013
- EPEPS 2013
Effect of preformed IMC layer on electromigration of solder capped cu pillar bump interconnection on an organic substrate
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2012
- IMAPS 2012
Joint reliability study of solder capped metal pillar bump interconnections on an organic substrate
- Kazushige Toriyama
- Yasushi Takeoka
- et al.
- 2012
- ICSJ 2012
Effect of preformed Cu-Sn IMC layer on electromigration reliability of solder capped Cu pillar bump interconnection on an organic substrate
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2012
- ICSJ 2012
Microstructure observation of electromigration behavior in peripheral C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- IMAPS 2011