Electromigration Cu mass flow in Cu interconnections
- C.-K. Hu
- D. Canaperi
- et al.
- 2006
- Thin Solid Films
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28 results for J.R. Lloyd
Theory for electromigration failure in Cu conductors
- J.R. Lloyd
- C.E. Murray
- et al.
- 2005
- International Workshop on Stress-Induced Phenomena in Metallization 2005
Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
- Albert T. Wu
- N. Tamura
- et al.
- 2005
- MRS Spring Meeting 2005
Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction
- Albert T. Wu
- J.R. Lloyd
- et al.
- 2005
- APM 2005
Effect of moisture on the Time Dependent Dielectric Breakdown (TDDB) behavior in an ultra-low-k (ULK) dielectric
- J.R. Lloyd
- T.M. Shaw
- et al.
- 2005
- IIRW 2005
Simple model for time-dependent dielectric breakdown in inter- and intralevel low- k dielectrics
- J.R. Lloyd
- E. Liniger
- et al.
- 2005
- Journal of Applied Physics
Electromigration and adhesion
- James R. Lloyd
- Michael W. Lane
- et al.
- 2005
- IEEE T-DMR
Successful dual damascene integration of extreme low k materials (k < 2.0) using a novel gap fill based integration scheme
- S.V. Nitta
- S. Purushothaman
- et al.
- 2004
- IEDM 2004
Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction
- Albert T. Wu
- K.N. Tu
- et al.
- 2004
- Applied Physics Letters
Reliability challenges with ultra-low k interlevel dielectrics
- J.R. Lloyd
- M. Lane
- et al.
- 2004
- Microelectronics Reliability