Black's law revisited-Nucleation and growth in electromigration failure
- J.R. Lloyd
- 2007
- Microelectronics Reliability
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28 results for J.R. Lloyd
The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics
- J.R. Lloyd
- C.E. Murray
- et al.
- 2006
- Microelectronics Reliability
Simple model for time-dependent dielectric breakdown in inter- and intralevel low- k dielectrics
- J.R. Lloyd
- E. Liniger
- et al.
- 2005
- Journal of Applied Physics
Electromigration and adhesion
- James R. Lloyd
- Michael W. Lane
- et al.
- 2005
- IEEE T-DMR
Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction
- Albert T. Wu
- K.N. Tu
- et al.
- 2004
- Applied Physics Letters
Effects of failure criteria on the lifetime distribution of dual-damascene Cu line/via on W
- R.F. Liu
- C.-K. Hu
- et al.
- 2004
- Journal of Applied Physics
Electromigration induced resistance decrease in Sn conductors
- J.R. Lloyd
- 2003
- Journal of Applied Physics
Relationship between interfacial adhesion and electromigration in Cu metallization
- M.W. Lane
- E. Liniger
- et al.
- 2003
- Journal of Applied Physics