Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability
- Mukta Farooq
- Giuseppe La Rosa
- et al.
- 2015
- IRPS 2015
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17 results for C. Kothandaraman
Copper through silicon via (TSV) for 3D integration
- C. Kothandaraman
- B. Himmel
- et al.
- 2012
- IRPS 2012
A cost effective 32nm high-K/metal gate CMOS technology for low power applications with single-metal/gate-first process
- X. Chen
- S. Samavedam
- et al.
- 2008
- VLSI Technology 2008
A compact eFUSE programmable array memory for SOI CMOS
- John Safran
- Alan Leslie
- et al.
- 2007
- VLSI Circuits 2007
Reliability investigation of NiPtSi electrical fuse with different programming mechanisms
- C. Tian
- D. Moy
- et al.
- 2007
- IIRW 2007
Electrically Programmable Fuse (eFUSE): From Memory Redundancy to Autonomic Chips
- Norm Robson
- John Safran
- et al.
- 2007
- CICC 2007
Reliability qualification of CoSI2 electrical fuse for 90NM technology
- C. Tian
- B. Park
- et al.
- 2006
- IRPS 2006