Integration and optimization of embedded-SiGe, compressive and tensile stressed liner films, and stress memorization in advanced SOI CMOS technologies
- M. Horstmann
- A. Wei
- et al.
- 2005
- IEDM 2005
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11 results for L. Su
Dual stress liner for high performance sub-45nm gate length SOI CMOS manufacturing
- H.S. Yang
- R. Malik
- et al.
- 2004
- IEDM 2004
Functional high-speed characterization and modeling of a six-layer copper wiring structure and performance comparison with aluminum on-chip interconnections
- A. Deutsch
- H. Harrer
- et al.
- 1998
- IEDM 1998
High-performance sub-0.08 μm CMOS with dual gate oxide and 9.7 ps inverter delay
- M. Hargrove
- S.W. Crowder
- et al.
- 1998
- IEDM 1998
RF perspective of sub-tenth-micron CMOS
- C. Wann
- L. Su
- et al.
- 1998
- ISSCC 1998
Full copper wiring in a sub-0.25 μm CMOS ULSI technology
- D. Edelstein
- J. Heidenreich
- et al.
- 1997
- IEDM 1997
Electrical characteristics and reliability of sub-3 nm gate oxides grown on nitrogen implanted silicon substrates
- L.K. Han
- S.W. Crowder
- et al.
- 1997
- IEDM 1997
A High-Density 6.9 sq. pm Embedded SRAM Cell in a High-Performance 0.25 μm-Generation CMOS Logic Technology
- S. Subbanna
- P. Agnello
- et al.
- 1996
- IEDM 1996
High performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell
- E. Leobandung
- H. Nayakama
- et al.
- 2005
- VLSI Technology 2005
High-performance sub-0.25 μm CMOS technology with multiple thresholds and copper interconnects
- L. Su
- R. Schulz
- et al.
- 1998
- VLSI Technology 1998