Polymer self assembly in semiconductor microelectronics
- Charles T. Black
- Ricardo Ruiz
- et al.
- 2007
- IBM J. Res. Dev
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43 results for K.W. Guarini
Highly porous silicon membrane fabrication using polymer self-assembly
- C.T. Black
- K.W. Guarini
- et al.
- 2006
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Polymer self assembly in semiconductor microelectronics
- C.T. Black
- K.W. Guarini
- et al.
- 2006
- IEDM 2006
Three-dimensional integrated circuits
- Anna W. Topol
- Douglas C. La Tulipe Jr.
- et al.
- 2006
- IBM J. Res. Dev
Effect of tensile uniaxial stress on the electron transport properties of deeply scaled FD-SOI n-type MOSFETs
- H. Nayfeh
- D. Singh
- et al.
- 2006
- IEEE Electron Device Letters
Germanium channel MOSFETs: Opportunities and challenges
- Huiling Shang
- Martin M. Frank
- et al.
- 2006
- IBM J. Res. Dev
Effect of contact liner stress in high-performance FDSOI devices with ultra-thin silicon channels and 30 nm gate lengths
- D. Singh
- J. Hergenrother
- et al.
- 2005
- IEEE International SOI Conference 2005
Assembly technology for three dimensional integrated circuits
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- VMIC 2005
Stable SRAM cell design for the 32 nm node and beyond
- Leland Chang
- David M. Fried
- et al.
- 2005
- VLSI Technology 2005
Mobility and CMOS devices/circuits on sub-10nm (110) ultra thin body SOI
- Huiling Shang
- J. Rubino
- et al.
- 2005
- VLSI Technology 2005