Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- IEDM 2005
Publications
Date
Featured collections
Popular topics
43 results for K.W. Guarini
Mobility and CMOS devices/circuits on sub-10nm (110) ultra thin body SOI
- Huiling Shang
- J. Rubino
- et al.
- 2005
- VLSI Technology 2005
Ultra-thin SOI replacement gate CMOS with ALD TaN / high-k gate stack
- B. Doris
- B.P. Linder
- et al.
- 2005
- VLSI-TSA 2005
Enabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures
- Anna W. Topol
- Bruce K. Furman
- et al.
- 2004
- ECTC 2004
Aggressively scaled (0.143 μm 2) 6T-SRAM cell for the 32 nm node and beyond
- D. Fried
- J. Hergenrother
- et al.
- 2004
- IEDM 2004
Selectively formed high mobility strained Ge PMOSFETs for high performance CMOS
- Hulling Shang
- Jack O. Chu
- et al.
- 2004
- IEDM 2004
Fabrication, device design and mobility enhancement of germanium channel MOSFETs
- Huiling Shang
- E. Gousev
- et al.
- 2004
- ICSICT 2004
High-capacity, self-assembled metal-oxide-semiconductor decoupling capacitors
- Charles T. Black
- Kathryn W. Guarini
- et al.
- 2004
- IEEE Electron Device Letters
Channel design and mobility enhancement in strained germanium buried channel MOSFETs
- H. Shang
- J.O. Chu
- et al.
- 2004
- VLSI Technology 2004
Growth of silicon oxide in thin film block copolymer scaffolds
- Dong Ha Kim
- Xinqiao Jia
- et al.
- 2004
- Advanced Materials