A study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH z
- C.-K. Hu
- D. Canaperi
- et al.
- 2003
- AMC 2003
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14 results for J. Rubino
Reduced Cu interface diffusion by CoWP surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Microelectronic Engineering
Reduced electromigration of Cu wires by surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- Applied Physics Letters
Vertical electrical connections for multi-layer stacked display
- K. Matsumoto
- K. Takeda
- et al.
- 2002
- Asia Display/IDW 2002