Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
- Sung K. Kang
- Da-Yuan Shih
- et al.
- 2004
- JOM
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15 results for Donald W. Henderson
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
- Sung K. Kang
- Won Kyoung Choi
- et al.
- 2003
- JOM
Interfacial reaction studies on lead (Pb)-free solder alloys
- Sung K. Kang
- D.Y. Shih
- et al.
- 2002
- IEEE Transactions on Electronics Packaging Manufacturing
Ag3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys
- Donald W. Henderson
- Timothy Gosselin
- et al.
- 2002
- Journal of Materials Research
Interfacial reactions, microstructure and mechanical properties of Pb-free solder joints in PBGA laminates
- S.K. Kang
- W.K. Choi
- et al.
- 2002
- Proceedings - Electronic Components and Technology Conference