Optimizing ULK film properties to enable BEOL integration with TDDB reliability
- E. T. Ryan
- Deepika Priyadarshini
- et al.
- 2015
- IITC/MAM 2015
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155 results for Alfred Grill
Induced e-beam charge impact on spatial orientation of gate-All-Around silicon wires device fabricated on boron nitride substrate
- Shimon Levi
- Konstantin Chirko
- et al.
- 2015
- SPIE Advanced Lithography 2015
Advanced metal and dielectric barrier cap films for Cu low k interconnects
- Deepika Priyadarshini
- Son Nguyen
- et al.
- 2014
- IITC/AMC 2014
CD-SEM metrology evaluation of gate-all-around Si nanowire MOSFET with improved control of nanowire suspension by using a buried boron nitride etch-stop layer
- Guy M. Cohen
- Leathen Shi
- et al.
- 2014
- ASMC 2014
Ultrathin (8-14 nm) conformal SiN for sub-20 nm Copper/Low-k Interconnects
- Son Van Nguyen
- Deepika Priyadarshini
- et al.
- 2014
- ECS Meeting 2014
Graphene technology for RF and THz applications
- Alberto Valdes-Garcia
- Fengnian Xia
- et al.
- 2013
- IMS 2013
UV cure impact on robust low-k with sub-nm pores and high carbon content for high performance Cu/low-k BEOL modules
- N. Inoue
- F. Ito
- et al.
- 2013
- IITC 2013
Tailoring dielectric materials for robust BEOL reliability
- G. Bonilla
- T.M. Shaw
- et al.
- 2012
- IRPS 2012
In-situ metal/dielectric capping process for electromigration enhancement in Cu interconnects
- Chih-Chao Yang
- Fen Chen
- et al.
- 2012
- IITC 2012
Designing porous ultra low-κ dielectrics to meet scaling challenges
- E. Todd Ryan
- Steve Gates
- et al.
- 2011
- ADMETA 2011