Interaction of hydrogen plasma with extreme low-k SiCOH dielectrics
- A. Grill
- V.V. Patel
- 2004
- JES
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155 results for Alfred Grill
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Structural characterization of porous low-k thin films prepared by different techniques using x-ray porosimetry
- Hae-Jeong Lee
- Christopher L. Soles
- et al.
- 2004
- Journal of Applied Physics
Moisture and oxygen uptake in Low K/ copper interconnect structures
- T.M. Shaw
- D. Jimerson
- et al.
- 2003
- ADMETA 2003
Structure of low dielectric constant to extreme low dielectric constant SiCOH films: Fourier transform infrared spectroscopy characterization
- Alfred Grill
- Deborah A. Neumayer
- 2003
- Journal of Applied Physics
Hardmask technology for sub-100 nm lithographic imaging
- Katherina Babich
- Arpan P. Mahorowala
- et al.
- 2003
- Microlithography 2003
Porosity in plasma enhanced chemical vapor deposited SiCoH dielectrics: A comparative study
- A. Grill
- V.V. Patel
- et al.
- 2003
- Journal of Applied Physics
Static frequency divider circuit using 0.15 μm gate length Si0.2Ge0.8/Si0.7Ge0.3 p-MODFETs
- D. Singh
- S.J. Koester
- et al.
- 2003
- Electronics Letters
Plasma enhanced chemical vapor deposited SiCOH dielectrics: From low-k to extreme low-k interconnect materials
- Alfred Grill
- 2003
- Journal of Applied Physics
High-quality crystalline layer transfer from a silicon-on-insulator substrate onto a sapphire substrate using wafer bonding
- D. Singh
- L.T. Shi
- et al.
- 2003
- Journal of Electronic Materials