TSV Stress Evolution Mapping using in-line Raman Spectroscopy
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
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12 results for Daniel Schmidt
Impact of high-NA half-field to full-field overlay performance by Monte Carlo simulations
- Romain Lallement
- Daniel Schmidt
- et al.
- 2023
- OEN 2023
Vertical Travelling Scatterometry for Metrology on Fully Integrated Devices
- D. Schmidt
- Manasa Medikonda
- et al.
- 2022
- SPIE Advanced Lithography 2022
Advanced EUV Resist Characterization using Scatterometry and Machine Learning
- Daniel Schmidt
- Karen Petrillo
- et al.
- 2021
- ASMC 2021
Effect of high NA "half-field" printing on overlay error
- Allen Gabor
- Martin Burkhardt
- et al.
- 2021
- SPIE Advanced Lithography 2021
OCD enhanced: Implementation and validation of spectral interferometry for nanosheet inner spacer indentation
- Daniel Schmidt
- C. Durfee
- et al.
- 2021
- SPIE Advanced Lithography 2021
In-line Raman spectroscopy for stacked nanosheet device manufacturing
- Daniel Schmidt
- C. Durfee
- et al.
- 2021
- SPIE Advanced Lithography 2021
Characterization of EUV image fading induced by overlay corrections using pattern shift response metrology
- Daniel Schmidt
- Roger Cornell
- et al.
- 2019
- EUVL 2019
Leakage aware Si/SiGe CMOS FinFET for low power applications
- G. Tsutsui
- C. Durfee
- et al.
- 2018
- VLSI Technology 2018
Review of nanosheet metrology opportunities for technology readiness
- Mary A. Breton
- Daniel Schmidt
- et al.
- 2022
- JM3