Electromigration in AlCu lines: Comparison of Dual Damascene and metal reactive ion etching
- R. Filippi
- M. Gribelyuk
- et al.
- 2001
- Thin Solid Films
Publications
6 results for G. Stojakovic
New aqueous clean for aluminum interconnects: Part I. Fundamentals
- D.L. Rath
- R. Ravikumar
- et al.
- 2000
- Diffusion and Defect Data Pt.B: Solid State Phenomena
New aqueous clean for aluminum interconnects: Part II. Applications
- R. Ravikumar
- D.L. Rath
- et al.
- 2000
- Diffusion and Defect Data Pt.B: Solid State Phenomena
Reactive ion etch of 150 nm Al lines for interconnections in dynamic random access memory
- G. Stojakovic
- X.J. Ning
- 2000
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Challenges of Aluminum RIE Technology at sub 0.45 μm Pitches
- R. Ravikumar
- R. Filippi
- et al.
- 1999
- IITC 1999
Influence of sidewall roughness on the reliability of 0.20-μm Al RIE wiring
- R. Ravikumar
- H. Cichy
- et al.
- 1999
- IITC 1999