Eloisa Bentivegna
Big Data 2022
The integration of a new aqueous clean, dSP+, has been demonstrated for aluminum interconnect technology in advanced DRAM products. The dSP+ chemistry was targeted for two back-end-of-line (BEOL) applications: post Al RIE clean and via clean. The results in this paper are discussed using SEM, reliability, and electrical parametric data.
Eloisa Bentivegna
Big Data 2022
Heinz Schmid, Hans Biebuyck, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Fernando Marianno, Wang Zhou, et al.
INFORMS 2021
Sang-Min Park, Mark P. Stoykovich, et al.
Advanced Materials