Ruthenium interconnect resistivity and reliability at 48 nm pitch
- Xunyuan Zhang
- Huai Huang
- et al.
- 2016
- IITC/AMC 2016
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129 results for Eric G. Liniger
Post porosity plasma protection integration at 48 nm pitch
- H. Huang
- Krystelle Lionti
- et al.
- 2016
- IITC/AMC 2016
Ultrathin conformal multilayer SiNO dielectric cap for capacitance reduction in Cu/low k interconnects
- Deepika Priyadarshini
- Son Van Nguyen
- et al.
- 2016
- IITC/AMC 2016
Optimizing ULK film properties to enable BEOL integration with TDDB reliability
- E. T. Ryan
- Deepika Priyadarshini
- et al.
- 2015
- IITC/MAM 2015
Impedance spectroscopy studies of moisture uptake in low-k dielectrics and its relation to reliability
- A. Raja
- Robert B. Laibowitz
- et al.
- 2015
- Microelectronic Engineering
Reliability challenges for the 10nm node and beyond
- 2014
- IEDM 2014
Detection of charge carrier confinement into mobile ionic defects in nanoporous dielectric films for advanced interconnects
- Juan Borja
- Joel L. Plawsky
- et al.
- 2014
- JVSTA
Low-field TDDB reliability data to enable accurate lifetime predictions
- Eric G. Liniger
- Stephan A. Cohen
- et al.
- 2014
- IRPS 2014
Advanced metal and dielectric barrier cap films for Cu low k interconnects
- Deepika Priyadarshini
- Son Nguyen
- et al.
- 2014
- IITC/AMC 2014
Ultrathin (8-14 nm) conformal SiN for sub-20 nm Copper/Low-k Interconnects
- Son Van Nguyen
- Deepika Priyadarshini
- et al.
- 2014
- ECS Meeting 2014