E. Todd Ryan, Steve Gates, et al.
ADMETA 2011
A 30 month module-based low-field TDDB study of 90nm pitch Back End of the Line (BEOL) interconnect structures and a 9 month study of 80nm pitch BEOL structures have shown that the commonly used root-E extrapolation model is overly conservative at predicting TDDB lifetimes at low applied fields. A less conservative acceleration model is required to make accurate lifetime predictions at low fields. © 2014 IEEE.
E. Todd Ryan, Steve Gates, et al.
ADMETA 2011
Jack C. Hay, Eric G. Liniger, et al.
Journal of Materials Research
Willi Volksen, Teddie P. Magbitang, et al.
JES
Wen Liu, Giuseppe La Rosa, et al.
IRPS 2014