Low thermal budget antimony/phosphorus NMOS technology for CMOS
- D.L. Harame
- E. Ganin
- et al.
- 1991
- IEDM 1991
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119 results for Stephan A. Cohen
Characterization of "ultrathin-Cu"/Ru(Ta)/TaN liner stack for copper interconnects
- C.-C. Yang
- S. Cohen
- et al.
- 2010
- IEEE Electron Device Letters
Characterization of thin dielectric films as copper diffusion barriers using triangular voltage sweep
- S. Cohen
- J.C. Liu
- et al.
- 1999
- MRS Spring Meeting 1999
Low dielectric constant SiCOH films as potential candidates for interconnect dielectrics
- A. Grill
- L. Perraud
- et al.
- 1999
- MRS Spring Meeting 1999
Novel low k Dielectric materials for nano device interconnect technology
- Son Van Nguyen
- Hosadurga Shobha
- et al.
- 2020
- VLSI-TSA 2020
Electromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires
- C. K. Hu
- James Kelly
- et al.
- 2017
- IITC 2017
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- Son Van Nguyen
- Shobha Hosadugra
- et al.
- 2017
- ECS Meeting 2017 - New Orleans
Effect of H2O on TDDB for a range of ULK ILD materials with varying damage resistance for robust and weak liners
- Eric G. Liniger
- Robert B. Laibowitz
- et al.
- 2016
- IRPS 2016
Triangular Voltage Sweep (TVS) characterisation for Through-Silicon-Via (TSV) reliability
- C. Kothandaraman
- Stephan A. Cohen
- 2016
- IRPS 2016
Ultrathin conformal multilayer SiNO dielectric cap for capacitance reduction in Cu/low k interconnects
- Deepika Priyadarshini
- Son Van Nguyen
- et al.
- 2016
- IITC/AMC 2016