Underlayer effects on texture evolution in copper films
- C.E. Murray
- K.P. Rodbell
- et al.
- 2006
- Thin Solid Films
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20 results for P. M. Vereecken
The morphology and nucleation kinetics of copper islands during electrodeposition
- A. Radisic
- P.M. Vereecken
- et al.
- 2006
- Surface Science
Electrochemical characterization of adsorption-desorption of the cuprous-suppressor-chloride complex during electrodeposition of copper
- John G. Long
- Peter C. Searson
- et al.
- 2006
- JES
Quantifying electrochemical nucleation and growth of nanoscale clusters using real-time kinetic data
- Aleksandar Radisic
- Philippe M. Vereecken
- et al.
- 2006
- Nano Letters
Electrodeposition of bismuth thin films on n-GaAs (110)
- Philippe M. Vereecken
- Kenneth Rodbell
- et al.
- 2005
- Applied Physics Letters
The chemistry of additives in damascene copper plating
- Philippe M. Vereecken
- Robert A. Binstead
- et al.
- 2005
- IBM J. Res. Dev
Liner materials for direct electrodeposition of Cu
- M.W. Lane
- C.E. Murray
- et al.
- 2003
- Applied Physics Letters
Electrodeposition of Bi1-xSbx thin films
- P.M. Vereecken
- S. Ren
- et al.
- 2003
- JES
Kinetics of particle codeposition of nanocomposites
- I. Shao
- P.M. Vereecken
- et al.
- 2002
- JES
Synthesis and characterization of particle-reinforced Ni/Al2O3 nanocomposites
- I. Shao
- P.M. Vereecken
- et al.
- 2002
- Journal of Materials Research