Electrodeposition of bismuth thin films on n-GaAs (110)
- Philippe M. Vereecken
- Kenneth Rodbell
- et al.
- 2005
- Applied Physics Letters
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20 results for P. M. Vereecken
The chemistry of additives in damascene copper plating
- Philippe M. Vereecken
- Robert A. Binstead
- et al.
- 2005
- IBM J. Res. Dev
Integration of direct plating of Cu onto a CVD Ru liner
- S. Malhotra
- D. Canaperi
- et al.
- 2004
- AMC 2004
Uniform copper electroplating on resistive substrates
- Rui Fang
- Keisuke Namiki
- et al.
- 2004
- ECS Meeting 2004
Liner materials for direct electrodeposition of Cu
- M.W. Lane
- C.E. Murray
- et al.
- 2003
- Applied Physics Letters
Dynamic microscopy of nanoscale cluster growth at the solid-liquid interface
- M.J. Williamson
- R.M. Tromp
- et al.
- 2003
- Nature Materials
Electrodeposition of Bi1-xSbx thin films
- P.M. Vereecken
- S. Ren
- et al.
- 2003
- JES
Kinetics of particle codeposition of nanocomposites
- I. Shao
- P.M. Vereecken
- et al.
- 2002
- JES
In situ transmission electron microscopy of copper electrodeposition
- Frances M. Ross
- Mark J. Williamson
- et al.
- 2002
- Microscopy and Microanalysis
Synthesis and characterization of particle-reinforced Ni/Al2O3 nanocomposites
- I. Shao
- P.M. Vereecken
- et al.
- 2002
- Journal of Materials Research