A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels
- Ruilong Xie
- Pietro Montanini
- et al.
- 2016
- IEDM 2016
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
Date
Featured collections
Popular topics
18 results for Bassem Hamieh
Defect detection strategies and process partitioning for SE EUV patterning
- Luciana Meli
- Karen Petrillo
- et al.
- 2018
- SPIE Advanced Lithography 2018
Stacked nanosheet gate-all-around transistor to enable scaling beyond FinFET
- N. Loubet
- T.B. Hook
- et al.
- 2017
- VLSI Technology 2017
Single-expose patterning development for EUV lithography
- Anuja De Silva
- Karen Petrillo
- et al.
- 2017
- SPIE Advanced Lithography 2017
Reaching for the true overlay in advanced nodes
- Chiew-Seng Koay
- Bassem Hamieh
- et al.
- 2017
- SPIE Advanced Lithography 2017
BEOL process integration for the 7 nm technology node
- T. Standaert
- Genevieve Beique
- et al.
- 2016
- IITC/AMC 2016
EUV patterning successes and frontiers
- Nelson Felix
- Daniel Corliss
- et al.
- 2016
- SPIE Advanced Lithography 2016
Assessments of image-based and scatterometry-based overlay targets
- Chiew-Seng Koay
- Nelson Felix
- et al.
- 2016
- SPIE Advanced Lithography 2016
Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)
- Yannick Feurprier
- Katie Lutker-Lee
- et al.
- 2015
- SPIE Advanced Lithography 2015
Plasma etch challenges with new EUV lithography material introduction for patterning for MOL and BEOL
- Changwoo Lee
- Bhaskar Nagabhirava
- et al.
- 2015
- SPIE Advanced Lithography 2015