Fully aligned via integration for extendibility of interconnects to beyond the 7 nm node
- Benjamin D. Briggs
- C.B. Peethala
- et al.
- 2017
- IEDM 2017
Publications
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19 results for Yongan Xu
Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL
- Benjamin D. Briggs
- C.B. Pcethala
- et al.
- 2018
- IITC 2018
Polymer brush as adhesion promoter for EUV patterning
- Jing Guo
- Anuja De Silva
- et al.
- 2018
- SPIE Advanced Lithography 2018
Self-aligned blocking integration demonstration for critical sub-30nm pitch Mx level patterning with EUV self-aligned double patterning
- Angelique Raley
- Joe Lee
- et al.
- 2018
- SPIE Advanced Lithography 2018
Development of amorphous silicon based EUV hardmasks through physical vapor deposition
- Anuja De Silva
- Yann Mignot
- et al.
- 2017
- SPIE Photomask Technology + EUV Lithography 2017
Coater/developer based techniques to improve high-resolution EUV patterning defectivity
- Koichi Hontake
- Lior Huli
- et al.
- 2017
- SPIE Photomask Technology + EUV Lithography 2017
Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicle
- Cheng Chi
- Chi Chun Liu
- et al.
- 2017
- SPIE Advanced Lithography 2017
Lithographic qualification of high-Transmission mask blank for 10nm node and beyond
- Yongan Xu
- Tom Faure
- et al.
- 2016
- SPIE Advanced Lithography 2016
Ultimate 2D resolution printing with negative tone development
- Martin Burkhardt
- Yongan Xu
- et al.
- 2016
- SPIE Advanced Lithography 2016
DSA via hole shrink for advanced node applications
- Cheng Chi
- Chi Chun Liu
- et al.
- 2016
- SPIE Advanced Lithography 2016