EUV patterning successes and frontiers
- Nelson Felix
- Daniel Corliss
- et al.
- 2016
- SPIE Advanced Lithography 2016
Publications
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19 results for Yongan Xu
Comparison of left and right side line edge roughness in lithography
- Lei Sun
- Nicole Saulnier
- et al.
- 2016
- SPIE Advanced Lithography 2016
EUV processing and characterization for BEOL
- Nicole Saulnier
- Yongan Xu
- et al.
- 2015
- SPIE Advanced Lithography 2015
56 nm pitch copper dual-damascene interconnects with triple pitch split metal and double pitch split via
- James Hsueh-Chung Chen
- Christopher Waskiewicz
- et al.
- 2012
- IITC 2012
Robust ultrathin (20-25 nm) trilayer dielectric low k Cu damascene cap for sub-30 nm nanoelectronic devices
- Son Nguyen
- T. Haigh
- et al.
- 2011
- ECS Meeting 2011
64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning scheme
- Shyng-Tsong Chen
- Hideyuki Tomizawa
- et al.
- 2011
- IITC/MAM 2011
Fundamental investigation of Negative Tone Development (NTD) for the 22nm node (and beyond)
- Guillaume Landie
- Yongan Xu
- et al.
- 2011
- SPIE Advanced Lithography 2011
Self-aligned blocking integration demonstration for critical sub-30-nm pitch Mx level patterning with EUV self-aligned double patterning
- Angelique Raley
- Joe Lee
- et al.
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS
Design technology co-optimization assessment for directed self-Assembly-based lithography: Design for directed self-Assembly or directed self-Assembly for design
- Kafai Lai
- Chi Chun Liu
- et al.
- 2017
- J. Micro/Nanolithogr. MEMS MOEMS