Tommaso Stecconi, Roberto Guido, et al.
Advanced Electronic Materials
Multiple moisture evolutions/adsorptions pathways on the dielectric film surfaces and in the film bulk were linked to bonding voids contributions based on Zhuravlev model in silica. A die-to-die (DtD) and die-to-wafer (DtW) Cu/interlayer dielectric (ILD) hybrid bonding methodology has been successfully developed to reduce and eliminate moisture related voids with defect-free results.
Tommaso Stecconi, Roberto Guido, et al.
Advanced Electronic Materials
Max Bloomfield, Amogh Wasti, et al.
ITherm 2025
Victor Chan, A. Gasasira, et al.
IEEE Trans Semicond Manuf
Xiaofan Zhang, Haoming Lu, et al.
MLSys 2020