CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling
- Katsuyuki Sakuma
- Huan Hu
- et al.
- 2019
- IEEE Sensors Journal
Publications
82 results for John Knickerbocker
Turning the Finger into a Writing Tool
- Katsuyuki Sakuma
- Gaddi Blumrosen
- et al.
- 2019
- EMBC 2019
A wearable fingernail deformation sensing system and three-dimensional finite element model of fingertip
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2019
- ECTC 2019
Novel packaging structure and processes for micro-TFB (thin film battery) to enable miniaturized healthcare internet-of-things (IoT) devices
- Bing Dang
- Qianwen Chen
- et al.
- 2019
- ECTC 2019
Flexible Piezoresistive Sensors Fabricated by Spalling Technique
- Katsuyuki Sakuma
- Huan Hu
- et al.
- 2018
- IFETC 2018
Injection of Molten Solder (IMS) Technology for Solder Bumping on Wafers, Ceramic/Organic/Flexible Substrates, and Si Via Filling from Fine Pitch to Large Pitch
- Jae Woong Nah
- Li-Wen Hung
- et al.
- 2018
- ECTC 2018
High-speed precision handling technology of micro-chip for fan-out wafer level packaging (FOWLP) application
- Qianwen Chen
- Li-Wen Hung
- et al.
- 2018
- ECTC 2018
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
- John Knickerbocker
- Russell A. Budd
- et al.
- 2018
- ECTC 2018
Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2017
- SEMI-THERM 2017
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- Bing Dang
- Evan Colgan
- et al.
- 2016
- ECTC 2016