Bing Dang, Paul Andry, et al.
ECTC 2010
In this work, a novel packaging structure has been demonstrated for micro-TFB cells. Various semiconductor fabrication and assembly processes have been applied to thin substrate via formation and sealing, micro-TFB singulation and handling, as well as metallic sealing for hermetic battery packaging. Micro-TFB cells in the dimensions of 2.5mm x 2.5mm x 0.1mm have been fabricated and tested. A normalized capacity of ∼ 190 μAh/cm2 has been demonstrated.
Bing Dang, Paul Andry, et al.
ECTC 2010
Fanghao Yang, Mark D. Schultz, et al.
ITherm 2016
Qianwen Chen, Bing Dang, et al.
ECTC 2020
Akihiro Horibe, Kuniaki Sueoka, et al.
ECTC 2019