Characterization of stacked die using die-to-wafer integration for high yield and throughput
- K. Sakuma
- P. Andry
- et al.
- 2008
- ECTC 2008
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79 results for John Knickerbocker
300-Gb/s, 24-channel full-duplex, 850-nm, cmos-based optical transceivers
- C.L. Schow
- F.E. Doany
- et al.
- 2008
- OFC/NFOEC 2008
3D chip-stacking technology with through-silicon vias and low-volume lead free interconnections
- Katsuyuki Sakuma
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
3D chip stacking with C4 technology
- Bing Dang
- Steven L. Wright
- et al.
- 2008
- IBM J. Res. Dev
Thermomechanical modeling of 3D electronic packages
- Sri M. Sri-Jayantha
- Gerard McVicker
- et al.
- 2008
- IBM J. Res. Dev
Three-dimensional silicon integration
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
High-efficiency 60 GHz antenna fabricated using low-cost silicon micromachining techniques
- N. Hoivik
- D. Liu
- et al.
- 2007
- APS 2007
3D chip stacking technology with low-volume lead-free interconnections
- K. Sakuma
- P. Andry
- et al.
- 2007
- ECTC 2007
Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package
- B. Dang
- S.L. Wright
- et al.
- 2007
- ECTC 2007
CMOS-compatible through silicon vias for 3D process integration
- Cornelia K. Tsang
- Paul S. Andry
- et al.
- 2006
- MRS Fall Meeting 2006