300-Gb/s, 24-channel full-duplex, 850-nm, cmos-based optical transceivers
- C.L. Schow
- F.E. Doany
- et al.
- 2008
- OFC/NFOEC 2008
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78 results for John Knickerbocker
High-efficiency 60 GHz antenna fabricated using low-cost silicon micromachining techniques
- N. Hoivik
- D. Liu
- et al.
- 2007
- APS 2007
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ADMETA 2005
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology
- John U. Knickerbocker
- Chirag S. Patel
- et al.
- 2005
- CICC 2005
Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing
- Gaddi Blumrosen
- Katsuyuki Sakuma
- et al.
- 2020
- IEEE Access
CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling
- Katsuyuki Sakuma
- Huan Hu
- et al.
- 2019
- IEEE Sensors Journal
Embedded two-phase cooling of large three-dimensional compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2016
- ASME Journal of Electronic Packaging
An overview of through-silicon-via technology and manufacturing challenges
- Jeffrey P. Gambino
- Shawn A. Adderly
- et al.
- 2015
- Microelectronic Engineering
An 8x 10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
- Timothy O. Dickson
- Yong Liu
- et al.
- 2012
- IEEE Journal of Solid-State Circuits
Terabit/s-class optical PCB links incorporating 360-Gb/s bidirectional 850 nm parallel optical transceivers
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2012
- Journal of Lightwave Technology