Effects of contact area on mechanical strength, electrical resistance, and electromigration reliability of Cu/Low- k interconnects
- C.-C. Yang
- T.M. Shaw
- et al.
- 2010
- Electrochemical and Solid-State Letters
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143 results for Daniel Edelstein
Selective chemical vapor deposition-grown Ru for Cu interconnect capping applications
- C.-C. Yang
- Fenton R. McFeely
- et al.
- 2010
- Electrochemical and Solid-State Letters
Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps
- A. Grill
- D. Edelstein
- et al.
- 2008
- Journal of Applied Physics
Optimization of silicon technology for the IBM System z9
- Daniel J. Poindexter
- Scott R. Stiffler
- et al.
- 2007
- IBM J. Res. Dev
Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures
- F. Chen
- J. Gill
- et al.
- 2006
- Microelectronics Reliability
On-chip wiring design challenges for gigahertz operation operation
- Alina Deutsch
- Paul W. Coteus
- et al.
- 2001
- Proceedings of the IEEE
Copper metallization for high performance silicon technology
- R. Rosenberg
- D. Edelstein
- et al.
- 2000
- Annual Review of Materials Science
RF circuit design aspects of spiral inductors on silicon
- Joachim N. Burghartz
- D. Edelstein
- et al.
- 1998
- IEEE Journal of Solid-State Circuits
Spiral inductors and transmission lines in silicon technology using copper-damascene interconnects and low-loss substrates
- Joachim N. Burghartz
- Daniel C. Edelstein
- et al.
- 1997
- IEEE T-MTT
VLSI on-chip interconnection performance simulations and measurements
- D. Edelstein
- G.A. Sai-Halasz
- et al.
- 1995
- IBM J. Res. Dev