CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- E. Huang
- M. Oh
- et al.
- 2009
- ADMETA 2009
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31 results for D.L. Rath
A multilevel copper/low-k/airgap BEOL technology
- S.V. Nitta
- S. Ponoth
- et al.
- 2007
- ADMETA 2007
Etching of copper in deionized water rinse
- J.P. Gambino
- J. Robbins
- et al.
- 2008
- IPFA 2008
Advanced chemical-mechanical planarization (CMP) for enabling silicon carrier integration with through-vias and fine pitch wiring
- Cornelia K. Tsang
- Donald F. Canaperi
- et al.
- 2006
- CMP-MIC 2006
Improved manufacturability of Cu bond pads and implementation of seal design in 3D integrated circuits and packages
- K.N. Chen
- C. Tsang
- et al.
- 2006
- VMIC 2006
Electromigration Cu mass flow in Cu interconnections
- C.-K. Hu
- D. Canaperi
- et al.
- 2006
- Thin Solid Films
Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
A study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH z
- C.-K. Hu
- D. Canaperi
- et al.
- 2003
- AMC 2003
New aqueous clean for aluminum interconnects: Part I. Fundamentals
- D.L. Rath
- R. Ravikumar
- et al.
- 2000
- Diffusion and Defect Data Pt.B: Solid State Phenomena