The over-bump applied resin wafer-level underfill process: Process, material and reliability
- Claudius Feger
- Nancy LaBianca
- et al.
- 2009
- ECTC 2009
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41 results for Michael Gaynes
Delamination mechanisms of thermal interface materials in organic packages during reflow and moisture soaking
- Jiantao Zheng
- Virendra Jadhav
- et al.
- 2009
- ECTC 2009
Two-Phase Flow Characteristics in Radial Expanding Channels with Embedded Pin Fins
- Mark D. Schultz
- Michael Gaynes
- et al.
- 2018
- ITherm 2018
Eulerian multiphase conjugate model for embedded two-phase liquid cooled microprocessor
- Pritish R. Parida
- Mark D. Schultz
- et al.
- 2018
- SEMI-THERM 2018
Microfluidic two-phase cooling of a high power microprocessor part A: Design and fabrication
- Mark D. Schultz
- Pritish R. Parida
- et al.
- 2017
- ITherm 2017
Microfluidic two-phase cooling of a high power microprocessor part B: Test and characterization
- Mark D. Schultz
- Pritish R. Parida
- et al.
- 2017
- ITherm 2017
Thermal model for embedded two-phase liquid cooled microprocessor
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2017
- ITherm 2017
Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2017
- SEMI-THERM 2017
Local measurements of flow boiling heat transfer on hot spots In 3D compatible radial microchannels
- Fanghao Yang
- Mark D. Schultz
- et al.
- 2015
- InterPACK 2015
Embedded two-phase cooling of large 3D compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2015
- InterPACK 2015