Mitigating TSV-induced substrate noise coupling in 3-D IC using buried interface contacts
- Xiaoxiong Gu
- Joel Silberman
- et al.
- 2012
- EPEPS 2012
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93 results for Xiaoxiong Gu
Electrical interconnect design for testing of high-speed IC transceivers
- Renato Rimolo-Donadio
- Christian Baks
- et al.
- 2012
- EPEPS 2012
Backplane channel design optimization: Recasting a 3Gb/s link to operate at 25Gb/s and above
- Xiaoxiong Gu
- Young H. Kwark
- et al.
- 2012
- DesignCon 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
Efficient parametric modeling and analysis for backplane channel characterization
- Xiaoxiong Gu
- Ki Jin Han
- et al.
- 2012
- ECTC 2012
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
Accuracy of physics-based via models for simulation of dense via arrays
- Sebastian Müller
- Xiaomin Duan
- et al.
- 2012
- IEEE Trans Electromagn Compat
An 8x 10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
- Timothy O. Dickson
- Yong Liu
- et al.
- 2012
- IEEE Journal of Solid-State Circuits
Electrical performance of the recessed probe launch technique for measurement of embedded multilayer structures
- Miroslav Kotzev
- Renato Rimolo-Donadio
- et al.
- 2012
- IEEE Trans. Instrum. Meas.
Design and modeling methodology of vertical interconnects for 3DI applications
- Rachel Gordin
- David Goren
- et al.
- 2011
- IEEE Transactions on CPMT