NanoStack Transistor Architecture for CMOS 7A Node and Beyond
- S. Reboh
- C. Zhang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Publications
25 results for Michael Belyansky
Predictive Simulations and Experimental Study of AlN Bonding for Better Thermal Dissipation in BSPDN
- Sarabjot Singh
- Sangshin Jang
- et al.
- 2025
- IITC 2025
Characterization of Interfacial Fracture Strength in Hybrid Bonded Wafers: A Novel Approach for High-Resolution Spatial Profiling
- Sathya Raghavan
- Ben Yang
- et al.
- 2025
- ECTC 2025
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- Qianwen Chen
- Michael Belyansky
- et al.
- 2023
- ECTC 2023
Overlay Performance in Permanent Bonded Wafer Integration Schemes
- Nathan Ip
- Michael Belyansky
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Surface Energy Characterization for Die-Level Cu Hybrid Bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2022
- ECTC 2022
A new technique for evaluating stacked nanosheet inner spacer TDDB reliability
- Tian Shen
- K. Watanabe
- et al.
- 2020
- IRPS 2020
A Novel Dry Selective Etch of SiGe for the Enablement of High Performance Logic Stacked Gate-All-Around NanoSheet Devices
- Nicolas Loubet
- T. Devarajan
- et al.
- 2019
- IEDM 2019
Self-Allancd Gate Contact (SAGC) for CMOS technology scaling beyond 7nm
- Ruilong Xie
- Chanro Park
- et al.
- 2019
- VLSI Technology 2019
Study of alternate hardmasks for extreme ultraviolet patterning
- Anuja De Silva
- Indira Seshadri
- et al.
- 2016
- JVSTB