All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- Jonas Zürcher
- Luca Del Carro
- et al.
- 2016
- ECTC 2016
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21 results for Jonas Zürcher
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
- Jonas Zürcher
- Kerry Yu
- et al.
- 2015
- ECTC 2015
Direct investigation of microparticle self-assembly to improve the robustness of neck formation in thermal underfills
- Roman Stadler
- Luca Del Carro
- et al.
- 2017
- ITherm 2017
Scalable packaging platform supporting high-performance 3D chip stacks
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2017
- Pan Pacific 2017
Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ITherm 2016
Quantifying the thermal conductivity enhancement of percolating thermal underfills
- Brian R. Burg
- Jonas Zürcher
- et al.
- 2015
- EMPC 2015
Enhanced thermal underfills by bridging nanoparticle assemblies in percolating microparticle beds
- Jonas Zürcher
- Xi Chen
- et al.
- 2015
- NANO 2015
Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects
- Christian Hofmann
- Mario Baum
- et al.
- 2015
- SSI 2015
Thermal characterization of percolating thermal underfills: Bulk and cavity
- Brian R. Burg
- Manuel Koilly
- et al.
- 2014
- THERMINIC 2014
Thermo-mechanical properties of underfills at partial and full filler percolation - Sub-layering the underfill
- Gerd Schlottig
- Marie Haupt
- et al.
- 2014
- EuroSimE 2014