On the Evaporation of Colloidal Suspensions in Confined Pillar Arrays
- Jonas Zürcher
- Brian R. Burg
- et al.
- 2018
- Transport in Porous Media
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21 results for Jonas Zürcher
Thermally Conductive Composite Material with Percolating Microparticles Applied as Underfill
- Rahel Straessle
- Severin Zimmermann
- et al.
- 2018
- IEEE Transactions on CPMT
Direct investigation of microparticle self-assembly to improve the robustness of neck formation in thermal underfills
- Roman Stadler
- Luca Del Carro
- et al.
- 2017
- ITherm 2017
Relief printing of micron-sized electrical conductive structures on silicon
- S. Gerke
- Jonas Zürcher
- et al.
- 2017
- Flexible and Printed Electronics
Scalable packaging platform supporting high-performance 3D chip stacks
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2017
- Pan Pacific 2017
Enhanced percolating thermal underfills achieved by means of nanoparticle bridging necks
- Jonas Zürcher
- Xi Chen
- et al.
- 2016
- IEEE Transactions on CPMT
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ASME Journal of Electronic Packaging
All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- Jonas Zürcher
- Luca Del Carro
- et al.
- 2016
- ECTC 2016
Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ITherm 2016
Quantifying the thermal conductivity enhancement of percolating thermal underfills
- Brian R. Burg
- Jonas Zürcher
- et al.
- 2015
- EMPC 2015