Thermal stress evaluation of a PCRAM material Ge2Sb 2Te5
- K.N. Chen
- L. Krusin-Elbaum
- et al.
- 2006
- NVSMW 2006
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97 results for Stephen Rossnagel
Interconnect Issues post 45nm
- S.M. Rossnagel
- Robert L. Wisnieff
- et al.
- 2005
- IEDM 2005
Metal-organic atomic layer deposition of metals for applications in interconnect technology
- O. Van Der Straten
- S.M. Rossnagel
- et al.
- 2005
- ECS Meeting 2005
Robust TaN x diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
- H. Kim
- C. Detavenier
- et al.
- 2005
- Journal of Applied Physics
The physical properties of cubic plasma-enhanced atomic layer deposition TaN films
- H. Kim
- C. Lavoie
- et al.
- 2004
- Journal of Applied Physics
Alteration of Cu conductivity in the size effect regime
- S.M. Rossnagel
- T.S. Kuan
- 2004
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Plasma-enhanced atomic layer deposition of tantalum thin films: The growth and film properties
- H. Kim
- S.M. Rossnagel
- 2003
- Thin Solid Films
Thin film deposition with physical vapor deposition and related technologies
- S.M. Rossnagel
- 2003
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Thermodynamics and kinetics of room-temperature microstructural evolution in copper films
- C. Detavernier
- S.M. Rossnagel
- et al.
- 2003
- Journal of Applied Physics
Diffusion barrier properties of very thin TaN with high nitrogen concentration
- S.M. Rossnagel
- H. Kim
- 2003
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures