A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels
- Ruilong Xie
- Pietro Montanini
- et al.
- 2016
- IEDM 2016
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9 results for John H. Zhang
Reducing density-induced CMP non-uniformity for advanced semiconductor technology nodes
- John H. Zhang
- Wei-Tsu Tseng
- et al.
- 2013
- MRS Spring Meeting 2013
Cu CMP and its challenge for 20nm nodes and beyond
- John H. Zhang
- Wei-Tsu Tseng
- et al.
- 2012
- MRS Spring Meeting 2012
Optimizing stressor film deposition sequence in polish rate order for best planarization
- John H. Zhang
- Changyong Xiao
- et al.
- 2011
- MRS Spring Meeting 2011
CMP: Consideration of stop-on selectivity in advanced node semiconductor manufacturing technology
- Stan Tsai
- Hari Amanapu
- et al.
- 2017
- ECS Meeting 2017 - New Orleans
Post Cu CMP cleaning process evaluation for 32nm and 22nm technology nodes
- Wei-Tsu Tseng
- Donald Canaperi
- et al.
- 2012
- ASMC 2012
Cu CMP edge uniformity improvement studies for 32 nm technology node and beyond
- John H. Zhang
- Laertis Economikos
- et al.
- 2010
- MRS Online Proceedings Library
Developing contact oxide CUP process for 32 nm technology nodes
- John H. Zhang
- Rajasekhar Venigalla
- et al.
- 2008
- VMIC 2008
CMP Challenges for Advanced Technology Nodes
- John H Zhang
- Haigou Huang
- et al.
- 2017
- MRS Advances