Overlay improvement roadmap: Strategies for scanner control and product disposition for 5-nm overlay
- 2011
- SPIE Advanced Lithography 2011
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57 results for Matthew Colburn
Revisit pattern collapse for 14nm node and beyond
- Kenji Yoshimoto
- Craig Higgins
- et al.
- 2011
- SPIE Advanced Lithography 2011
Fundamental investigation of Negative Tone Development (NTD) for the 22nm node (and beyond)
- Guillaume Landie
- Yongan Xu
- et al.
- 2011
- SPIE Advanced Lithography 2011
Optimization of pitch-split double patterning photoresist for applications at the 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2011
- SPIE Advanced Lithography 2011
CD-SEM metrology of spike detection on sub-40 nm contact holes
- Yoshinori Momonoi
- Taro Osabe
- et al.
- 2010
- SPIE Advanced Lithography 2010
A 0.063 μm2 FinFET SRAM cell demonstration with conventional lithography using a novel integration scheme with aggressively scaled fin and gate pitch
- Veeraraghvan S. Basker
- Theodorus E. Standaert
- et al.
- 2010
- VLSI Technology 2010
Integration of directed self-assembly with 193 nm lithography
- Daniel P. Sanders
- Joy Cheng
- et al.
- 2010
- J. Photopolym. Sci. Tech.
Simple and versatile methods to integrate directed self-assembly with optical lithography using a polarity-switched photoresist
- Joy Y. Cheng
- Daniel P. Sanders
- et al.
- 2010
- ACS Nano
Fabrication of dual damascene BEOL structures using a Multi-Level Multiple Exposure (MLME) scheme - Part 1. Lithographic patterning
- Dario L. Goldfarb
- Stefan Harrer
- et al.
- 2010
- Proceedings of SPIE - The International Society for Optical Engineering 2010
Fabrication of dual damascene BEOL structures using a multi-level multiple exposure (MLME) scheme - Part 2. RIE-based pattern transfer and completion of dual damascene process yielding an electrically functional via chain
- Stefan Harrer
- John C Arnold
- et al.
- 2010
- Proceedings of SPIE - The International Society for Optical Engineering 2010