Qualification, monitoring, and integration into a production environment of the world's first fully programmable illuminator
- Gregory McIntyre
- Daniel Corliss
- et al.
- 2011
- SPIE Advanced Lithography 2011
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57 results for Matthew Colburn
EUV OPC for 56 nm metal pitch
- Martin Burkhardt
- Matt Colburn
- et al.
- 2011
- SPIE Advanced Lithography 2011
Overlay improvement roadmap: Strategies for scanner control and product disposition for 5-nm overlay
- 2011
- SPIE Advanced Lithography 2011
Revisit pattern collapse for 14nm node and beyond
- Kenji Yoshimoto
- Craig Higgins
- et al.
- 2011
- SPIE Advanced Lithography 2011
Optimization of pitch-split double patterning photoresist for applications at the 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2011
- SPIE Advanced Lithography 2011
Fundamental investigation of Negative Tone Development (NTD) for the 22nm node (and beyond)
- Guillaume Landie
- Yongan Xu
- et al.
- 2011
- SPIE Advanced Lithography 2011
CD-SEM metrology of spike detection on sub-40 nm contact holes
- Yoshinori Momonoi
- Taro Osabe
- et al.
- 2010
- SPIE Advanced Lithography 2010
A 0.063 μm2 FinFET SRAM cell demonstration with conventional lithography using a novel integration scheme with aggressively scaled fin and gate pitch
- Veeraraghvan S. Basker
- Theodorus E. Standaert
- et al.
- 2010
- VLSI Technology 2010
Fabrication of dual damascene BEOL structures using a multi-level multiple exposure (MLME) scheme - Part 2. RIE-based pattern transfer and completion of dual damascene process yielding an electrically functional via chain
- Stefan Harrer
- John C Arnold
- et al.
- 2010
- Proceedings of SPIE - The International Society for Optical Engineering 2010
Process characterization of pitch-split resist materials for application at 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2010
- Proceedings of SPIE - The International Society for Optical Engineering 2010