Submicron mapping of strain distributions induced by three-dimensional through-silicon via features
- Conal E. Murray
- T. Graves-Abe
- et al.
- 2013
- Applied Physics Letters
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25 results for R. R. Robison
22nm High-performance SOI technology featuring dual-embedded stressors, Epi-Plate High-K deep-trench embedded DRAM and self-aligned Via 15LM BEOL
- S. Narasimha
- P. Chang
- et al.
- 2012
- IEDM 2012
A Simple, unified 3D stress model for device design in stress-enhanced mobility technologies
- Arvind Kumar
- Kai Xiu
- et al.
- 2012
- SISPAD 2012
Leakage engineering enabling PDSOI ring oscillators operating in sub-100pA/μm Ioff regime
- Zhibin Ren
- Jin Cai
- et al.
- 2011
- CSTIC 2011
Impact of lateral asymmetric channel doping on 45-nm-technology N-Type SOI MOSFETs
- Hasan M. Nayfeh
- Nivo Rovedo
- et al.
- 2009
- IEEE Transactions on Electron Devices