Effect of microstructure and alloy doping on electromigration in Pb-free solder interconnect
- Minhua Lu
- 2013
- IIRW 2013
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Study of interfacial reaction and electromigration reliability of Pb-free solders with nickel iron barrier layer
- Minhua Lu
- Paul Lauro
- et al.
- 2011
- InterPACK 2011
Effect of microstructure on electromigration in Pb-free solder interconnect
- Minhua Lu
- 2010
- International Workshop STRESS-INDUCED PHENOMENA IN METALLIZATION 2010
Comparison of electromigration behaviors of SnAg and SnCu solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- IRPS 2009
Chip to carrier C4 technology challenges with Pb-free solders
- Eric D. Perfecto
- Brian Sundlof
- et al.
- 2008
- CICC 2008
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- D.Y. Shih
- B. Dang
- et al.
- 2008
- ICEPT-HDP 2008
Electromigration in Pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2008
- ICEPT-HDP 2008
A vapor chamber using graphite foams as wicks for cooling high heat flux electronics
- Minhua Lu
- Larry Mok
- et al.
- 2005
- InterPACK 2005
Ion beam alignment for liquid crystal display fabrication
- J. Doyle
- P. Chaudhari
- et al.
- 2003
- Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms
Reflective nematic LC devices for LCOS applications
- Minhua Lu
- K.H. Yang
- 2000
- EURODISPLAY 2000