Pb-free micro-joints (50 μm pitch) for the next generation micro-systems: The fabrication, assembly and characterization
- H. Gan
- S.L. Wright
- et al.
- 2006
- ECTC 2006
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28 results for Edmund Sprogis
A CMOS-compatible process for fabricating electrical through-vias in silicon
- P. Andry
- C. Tsang
- et al.
- 2006
- ECTC 2006
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ECTC 2005
Buried-trench DRAM cell using a self-aligned epitaxy over trench technology
- N.C.-C. Lu
- T.V. Rajeevakumar
- et al.
- 1988
- IEDM 1988
SPT CELL - A NEW SUBSTRATE - PLATE TRENCH CELL FOR DRAMS.
- N.C.-C. Lu
- P.E. Cottrell
- et al.
- 1984
- IEDM 1984
GaN Devices on a 200 mm Si Platform Targeting Heterogeneous Integration
- Ko-Tao Lee
- Can Bayram
- et al.
- 2017
- IEEE Electron Device Letters
Three-dimensional chip stack with integrated decoupling capacitors and thru-si via interconnects
- Bing Dang
- Michael Shapiro
- et al.
- 2010
- IEEE Electron Device Letters
Reliable through silicon vias for 3D silicon applications
- M.J. Shapiro
- M. Interrante
- et al.
- 2009
- IITC 2009
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ADMETA 2005
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology
- John U. Knickerbocker
- Chirag S. Patel
- et al.
- 2005
- CICC 2005